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Article: United States: Precision Process Equipment Introduces the Wafer Processing Game Changer with Excellite 1000 BCP.
- Article from:
- TendersInfo
- Article date:
- November 5, 2009
CopyrightCOPYRIGHT 2009 Al Bawaba (Middle East) Ltd. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Byline: datta03
Precision Process Equipment Inc, finds success with recently expanded line for solar cell, semi conductor and microelectronic packaging manufacturers.
The Excellite 1000 BCP is based on the success of the Excellite FSP, which was developed for wide-web, reel-to-reel (R2R) flexible substrate plating. The 1000 BCP plates flexible CIS, CIGS and TCO coatings for thin film solar cells. It plates on silicon or glass discrete part substrates with a fully automated dry in dry out cassette-to-cassette tool set.
The Excellite 1000 BCP can be configured for pre plate deposition of seed, barrier, and conductive layers, plating of a variety ...