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Article: ALCHIMER QUANTIFIES PAYOFF OF HIGH-ASPECT-RATIO TSVS.
- Article from:
- AsiaPulse News
- Article date:
- November 9, 2009
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(BW)(ALCHIMER-S.A.) Alchimer Quantifies Payoff of High-Aspect-Ratio TSVs: Move from 5:1 to 20:1 Can Save Over /Wafer by Reducing Space Needs
Cost Efficiency from Smaller TSV Footprint Significantly Expands Economic Advantages of AquiVia's Low Cost of Ownership for 3D Devices
Technology Editors
MASSY, France--(BUSINESS WIRE) - Nov. 03, 2009-- Alchimer S.A., leading provider of technology for the deposition of nanometric films used in both semiconductor interconnects and 3D through-silicon vias (TSV), has demonstrated that TSVs with aspect ratios of 20:1 can save chipmakers more than ...