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Article: New quantum electronics study findings have been reported from University of Tokyo.(Report)
- Article from:
- Electronics Newsweekly
- Article date:
- November 18, 2009
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"Hybrid integration of multiple optical chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems," researchers in Tokyo, Japan report.
"In this paper, we report successful 3-D integration of optical chips performed using Au-Au surface-activated bonding (SAB) at a relatively low bonding temperature of 150 degrees C. A glass substrate with the flip-chip-bonded photodiode chips was vertically stacked on a Si substrate with the bonded laser diode chip using Au-Au SAB. By applying this technique, compact and thin optical microsensors (2.8 mm x 2.8 mm x 1 mm thick) were fabricated," wrote E. Higurashi and ...