Article: Findings in nanoscience reported from Sogang University.

According to recent research from Seoul, South Korea, "In this work, the metal plated film was prepared by electroless plating techniques. The film was prepared for the fabrication of EMI shielding."

"Polyimide film was treated by base solution for etching and then activated by silver. The modified polyimide film was immersed into the electroless copper plating solution which has different molar ratios of nickel in the solution. The thickness and surface morphology of copper layer on the polyimide films were characterized with scanning electron microscopy (SEM)," wrote E.S. Ji and colleagues, Sogang University.

The researchers concluded: "Furthermore, ...

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