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Article: Applied Materials and SEMATECH Partner on Advanced Wafer Inspection Technology; Research Program Addresses Critical Need to Inspect High Aspect Ratio Device Structures.
- Article from:
- Business Wire
- Article date:
- November 12, 1998
CopyrightCOPYRIGHT 1998 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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SANTA CLARA, Calif.--(BUSINESS WIRE)--Nov. 12, 1998--Applied Materials, Inc. (Nasdaq/NMS:AMAT) today announced that it is working with SEMATECH on a program to detect sub-100 nanometer defects in very advanced devices featuring aspect ratios (depth/width) of 8:1 and beyond. The goal of this program is to investigate the use of Applied Materials' multi-perspective image acquisition and data processing techniques for detecting defects in next-generation interconnect structures.
"Based on the data Applied Materials is gathering for this program, our objective is to determine the optimal method for detecting and characterizing defects associated with high aspect ...