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Article: Tessera Announces New Process Delivering 50% Reduction in Rambus DRAM Packaging Costs.
- Article from:
- Business Wire
- Article date:
- February 29, 2000
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Business Editors/High-Tech Writers
Rambus Memory Solution Forum 2000
YOKOHAMA, Japan--(BUSINESS WIRE)--Feb. 29, 2000
Tessera's Widely-Used CSP Technology
Adopted by Rambus DRAM Manufacturers
Tessera(R) Inc., the industry's leading provider and licensor of chip-scale packaging (CSP) technology, today announced a new manufacturing process that will drastically reduce the package assembly costs of Rambus(R) DRAMs and other integrated circuits.
Tessera is unveiling its CSP cost reduction roadmap at the Rambus Memory Solution Forum 2000, taking place here March 1 and 2 at the Shin Yokohama Prince Hotel. Tessera's Zinger ...