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Article: Resin Transfer Molding (RTM) Process of a High Performance Epoxy Resin. I: Kinetic Studies of Cure Reaction.(Statistical Data Included)
- Article from:
- Polymer Engineering and Science
- Article date:
- April 1, 2000
- Author:
CopyrightCOPYRIGHT 2000 Society of Plastics Engineers, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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KUNG-HWA WEI [*]
The cure kinetics of a high performance PR500 epoxy resin in the temperature range of 160-197[degrees]C for the resin transfer molding (RTM) process have been investigated. The thermal analysis of the curing kinetics of PR500 resin was carried out by differential scanning calorimetry (DSC), with the ultimate heat of reaction measured in the dynamic mode and the rate of cure reaction and the degree of cure being determined under isothermal conditions. A modified Kamal's kinetic model was adapted to describe the autocatalytic and diffusion-controlled curing behavior of the resin. A reasonable agreement between the experimental data and the kinetic ...
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