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Article: New SECAP Consortium Steps Into WLP Void.
- Article from:
- Semiconductor International
- Article date:
- October 1, 2000
- Author:
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Last month, a new consortium was formed to optimize equipment for wafer-level bumping and packaging technologies. The Semiconductor Equipment Consortium for Advanced Packaging, or SECAP, has the Fraunhofer Institute for Reliability and Microintegration IZM (Munich, Germany) as its focal point, with Karl Suss (Munich), Semitool (Kalispell, Mont.), Unaxis and Image Technology as the initial participating companies.
The consortium's purpose is not to ensure a supply of tools so much as to ensure that all wafer-level packaging (WLP) equipment and technology work in harmony. WLP is one of the fastest-growing areas of packaging technology, and it can be viewed as an ...