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Article: Aehr Test Systems Completes DARPA Agreement on Wafer-Level Burn-in and Test System.
- Article from:
- PR Newswire
- Article date:
- January 3, 2001
CopyrightCOPYRIGHT 2001 PR Newswire Association LLC. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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FREMONT, Calif., Jan. 3 /PRNewswire/ --
Aehr Test Systems (Nasdaq: AEHR), a leading provider of systems for burning-in and testing DRAMs and other integrated circuits, today announced it has completed a multi-year research and development agreement with the U.S. Defense Advanced Research Projects Agency (DARPA). Aehr Test entered into the $6.5M agreement to develop a Wafer-Level Burn-in and Test system as part of a DARPA initiative to develop new technologies to enable the production of Known Good Die (KGD), which are unpackaged die that have been fully tested and burned-in.
A critical step in producing Known Good Die is the burn-in and testing cycle. ...