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Article: Flip-Chip Integrated Circuits.(Technology Information)
- Article from:
- Wireless Design & Development
- Article date:
- December 1, 2000
- Author:
CopyrightCOPYRIGHT 2000 Advantage Business Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Enabling low-cost commercial millimeterwave systems
Part one of this article (Nov. 2000) described the evolution of FCIC technology. It presented the core elements of FCICs-flip-chip die attach and coplanar transmission lines-and compared FCICs to the traditional chip-and-wire technology. The fundamental advantage of the FCIC approach is that expensive gallium arsenide (GaAs) and indium phosphide (InP) chip area is not used for passive components, resulting in significantly lowered system manufacturing costs.
This second part of the article presents the many other advantages of using FCICs. It also describes the challenges faced by designers using this ...
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Article: United States: USDA Approves Syngenta and John Deere for ...
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August 21, 2008 ;
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... ... Indiana, Minnesota, Nebraska, South Dakota and Wisconsin. Additional program details will be announced this fall. The FCICs approval of Agrisure and other traited corn seeds acknowledges reduced risk for growers, said Steve Ligon, Head, Syngenta ...
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