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Article: The World's Densest MCM Technology?(Brief Article)
- Article from:
- Electronic Packaging & Production
- Article date:
- May 1, 2001
- Author:
CopyrightCOPYRIGHT 2001 Reed Business Information. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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IBM has been producing multichip modules (MCMs) for its systems since 1979. Today's super-dense IBM eServer z900 MCM technology evolved from the water-cooled thermal conduction modules (TCMs) of IBM's bipolar 308X, 3090 and 9021 systems, and the MCMs of the first six generations of IBM's S/390 CMOS-based main frames. In 1994, IBM began using CMOS chip technology packaged on MCMs to annually provide additional performance to mainfame customers as designs and technology evolved. In 2000, IBM used its MCM technology to efficiently package a 16-way server, with three dedicated I/O processors, a spare and a robust L2 Cache; all within a 127 x 127 mm (5 x 5 in.) MCM. Advanced ...