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Article: BGA Repair: Ensuring Process Control and Saving Money -- A medium wavelength infrared system can be used to quickly and economically repair a wide range of area array packages.(ball grid array)(Statistical Data Included)
- Article from:
- Circuits Assembly
- Article date:
- June 1, 2001
- Author:
CopyrightCOPYRIGHT 2001 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Current international studies reinforce the global trend to area array packages. Ball grid arrays (BGAs), chip-scale packages (CSPs) and flip chips not only provide significantly more I/Os (input/output) per mm2 of printed circuit board (PCB) real estate, they also offer distinct electrical, mechanical and unit cost advantages. Increased density, reduced feature size and packaging all add up to shorter distances for electrical signals to travel, hence increasing speed and performance (Figure 1). Consequently, the numbers of flip chips and other advanced packages expected for 2002 have dramatically increased and will arrive at nearly 2 billion in the year 2003 (Figure 2).
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Article: Idaho Inventors Develop Stacked Ball Grid Array ...
US Fed News Service, Including US State News;
August 12, 2008 ;
440 words
... ... Trademark Office: "Ball grid array packages that can be stacked to form highly ... arrays are disclosed. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement ...
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