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Article: Flexible Circuit Origami: The Art of Packaging IC Chips with Flexible Circuits.(Brief Article)(Column)
- Article from:
- CircuiTree
- Article date:
- April 1, 2001
- Author:
CopyrightCOPYRIGHT 2001 BNP Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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The seemingly endless pressure to reduce the size of electronic products while either maintaining or increasing their functionality has resulted in the need for the manufacturer to pay utmost attention to every single element of an electronic product. The IC package is arguably the basic building block of electronics. It defines the limits of size; thus a bigger package means a bigger assembly, while a smaller package allows the assembly to shrink. This easily observable rubric has resulted in a significant amount of attention being given to IC packaging.
The result has been the introduction of an entirely new class of IC packages, introduced in the early- to ...