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Article: Fiber Glass Reinforcements within Circuit Board Composites.
- Article from:
- CircuiTree
- Article date:
- September 1, 2001
- Author:
CopyrightCOPYRIGHT 2001 BNP Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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INTRODUCTION
Circuit boards are not often thought of as sandwiches of composite materials. However, if one was to subject a typical circuit board to temperatures over 1200[degrees] F ([sim]650[degrees] C), one would see that the remaining copper and fiber glass reinforcements are part of the integral composite matrix of resin, glass, and copper. It is the engineered composite material properties that provide the foundation of the conductive and insulative matrix essential to circuit boards. The objectives of this article are to provide an overview of the manufacturing and functions of fiber glass reinforcement within circuit board composites and explore some of ...
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Article: Taiwanese Inventor Develops Precasting Multi-layer Printed ...
US Fed News Service, Including US State News;
June 6, 2007 ;
437 words
... ... Taiwan, has developed a precasting multi-layer printed circuit board (PCB) process. According to the U.S. Patent & ... the epoxy coated on the mold for the epoxy to cover up a fiber glass substrate; conductive material coated on the epoxy to insert ...
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