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Article: Physical Vapor Deposition Processes.
- Article from:
- Products Finishing
- Article date:
- September 1, 2001
- Author:
CopyrightCOPYRIGHT 2001 Gardner Publications, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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There are four types of physical vapor deposition processes: vacuum evaporation; sputter deposition; arc vapor deposition and ion plating. This article explains each process and its advantages and disadvantages ...
In physical vapor deposition (PVD) processes, atoms or molecules are vaporized from a solid or liquid source, transported in the form of a vapor through a vacuum or low-pressure gaseous environment and condensed on a substrate. PVD processes can be used to deposit films of elemental, alloy and compound materials as well as some polymeric materials. Typically, PVD processes are used to deposit films with a thickness range of a few angstroms ...