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Article: DENSO Introduces High Quality, Low Cost and Recyclable Multi-layered Printed Circuit Board.
- Article from:
- PR Newswire
- Article date:
- October 18, 2001
CopyrightCOPYRIGHT 2001 PR Newswire Association LLC. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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TOKYO, Oct. 18 /PRNewswire/ --
DENSO Corporation, parent company of Southfield, Mich.-based DENSO International America, Inc., today announced that it has developed a new high quality multi-layered printed circuit board -- PALUP (Patterned Prepreg Lay Up Process) board -- that can be formed at low cost by pressing together all constituting recyclable substrates.
"Multi-layered printed circuit boards are used as mount boards in various fields such as cellular phones, cellular phone base stations, large-scale computers and on-board electronic control units (ECUs)," said Mineo Hanai, DENSO Corporation director. "Recently, electronic parts have been improved ...