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Article: Tessera Technologies Introduces Packaging Solution Offering Significant Cost, Weight and Density Benefits for DDR Applications.
- Article from:
- Business Wire
- Article date:
- December 5, 2001
CopyrightCOPYRIGHT 2001 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Business Editors/High-Tech Writers
SAN JOSE, Calif.--(BUSINESS WIRE)--Dec. 5, 2001
Chip-scale Technology Demonstrated at SEMICON Japan Offers Alternative
to Stacked TSOPs Used in Servers, Workstations and Mobile Computing
Tessera Technologies Inc., a leading provider of intellectual property for chip-scale packaging (CSP), today introduced an advanced semiconductor packaging solution that allows OEMs and memory module manufacturers to maximize the density of their memory boards. Tessera will be demonstrating the solution from December 5-7 in booth A504 at SEMICON Japan, located in Hall 11 of the Makuhari Messe, Nippon Convention ...