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Article: Getting the vapors: The increasing use of lead-free solder has renewed interest in the vapor phase reflow process. (Electronics Assembly).
- Article from:
- Assembly
- Article date:
- February 1, 2002
- Author:
CopyrightCOPYRIGHT 2002 BNP Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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To eliminate lead from their products, electronics assemblers will have to do more than just change solder alloys. They'll have to change their reflow process, too. And while they're at it, assemblers may want to take a new look at an old standby: vapor phase soldering.
Invented in 1973, vapor phase reflow is as old as surface mount assembly itself. Despite some distinct advantages over infrared and convection reflow, those processes gradually supplanted vapor phase as the soldering methods of choice, especially for high-volume applications. Vapor phase reflow was primarily relegated to prototyping jobs and to small runs of highly complex, highly critical boards. ...