Article: KLA-Tencor Adds In-Line Defect Classification to Latest-Generation E-Beam Wafer Inspection Systems; New Capabilities Accelerate Advanced Process Development While Lowering Overall Cost of Ownership by Up to 50 Percent.

SAN JOSE, Calif. -- KLA-Tencor Corp. today announced that its latest-generation e-beam wafer inspection system, the eS20XP, now includes in-line automatic defect classification (iADC). This new option speeds time to results for defect classification and review by up to a factor of three when compared to manual review and classification, while simultaneously classifying up to ten times more defects for a given inspection. iADC reduces the cost of ownership (CoO) of e-beam inspection by up to 50 percent by enabling chipmakers to quickly classify and separate physical and electrical defects in real time during inspection. This allows chipmakers to achieve more sensitive ...

Related newspaper, magazine, and journal articles:

 
 
Newsweek Harper's Magazine The Washington Post Chicago Tribune Crain's Chicago Business PRNewswire Pediatric News The Nation Advertising Age The Economist (US) A FREE trial gives you access to over 80 million articles! Access over 6,500 publications with a FREE trial!