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Article: The evaluation of Tin Silver Bismuth and Tin Silver copper no-lead solder pastes and reflow techniques.(printec circuit boards)(Brief Article)
- Article from:
- CircuiTree
- Article date:
- April 1, 2002
- Author:
CopyrightCOPYRIGHT 2002 BNP Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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A study was conducted during the spring of 2001 to qualitatively evaluate a number of new no-lead solder pastes and reflow techniques. This study' built upon experience gained in a previous evaluation of no-lead solders and evolving industry experience.
In previous studies, the authors evaluated a number of no-lead solder alloys in conjunction with OSP - covered copper pads. These samples were reflowed in air and in nitrogen atmospheres utilizing a tent profile with a maximum spike temperature of 240[degrees]C and approximately 60 seconds above liquidous. Joints were micro-sectioned to evaluate the quality of intermetalic bonding and the prevalence of Voids. The ...