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Article: Embedded passives technology implementation in RF applications.
- Article from:
- CircuiTree
- Article date:
- June 1, 2002
- Author:
CopyrightCOPYRIGHT 2002 BNP Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Embedding resistors, inductors, and capacitors in HDI boards is the talk of the industry. This article, designated IPC Expo's best of show, demonstrates the performance trade-offs and design considerations that must be taken into account when embedding passive components into HDI board substrates.
Development of Embedded Passives (EP) technology was driven by the OEM need to decrease part count and board size, increase board functionality, and lower overall product costs. Passive parts represent a significant portion of the total number of components used in electronic devices, with resistors and capacitors making up the bulk. Historically, a typical GSM phone ...