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Article: Low-pressure injection molding with polyamide hot melts: offers key advantages in electrical-and electronic-component manufacturing.
- Article from:
- Adhesives & Sealants Industry
- Article date:
- June 1, 2002
- Author:
CopyrightCOPYRIGHT 2002 BNP Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Today's competitive marketplace is forcing manufacturers to reassess all aspects of production - from raw materials to capital equipment. New technologies are requiring new manufacturing methods that are still cost effective. Time-to-market, production flexibility and cost containment are all critical elements to be considered while ensuring you meet customers' performance requirements. Low-pressure injection molding with polyamide hot melts is one manufacturing method that can improve existing processes and meet the needs of today's ever-changing technology landscape.
Low-pressure molding is bringing injection-molding capability to applications previously ...
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