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Article: WLP: both ends meet in the middle? (On the Line).(development in wafer level packaging)(Brief Article)
- Article from:
- Electronic Packaging & Production
- Article date:
- September 1, 2002
CopyrightCOPYRIGHT 2002 Reed Business Information. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Returning from SEMICON West, I'm surprised to witness the amount of convergence from the front-and back ends of semiconductor manufacturing over wafer level packaging (WLP). Clearly, WLP was the show's hottest technology topic, perhaps overshadowed only by the pervasive discussions about the economy.
The driver for WLP, of course, is future business opportunities seen in portable communications devices, consumer electronics, military and aerospace and other high-end applications. For both ends of the semiconductor industry, wafer level is a logical extension of existing materials, process technology and equipment infrastructures.
In the near term, two ...