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Article: Fujitsu Microelectronics America Introduces High-Density Six-Chip Stacked Memory MCP for Cellular Applications; Advanced New PS-MCP Technology Serves Exciting New Cellular Telephone Capabilities.
- Article from:
- PR Newswire
- Article date:
- October 31, 2002
CopyrightCOPYRIGHT 2002 PR Newswire Association LLC. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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SAN JOSE, Calif. -- Fujitsu Limited today introduced a high-density, large-scale Multi-Chip Package (MCP) that stacks three flash, one SRAM, and two Fast Cycle RAM(TM) (FCRAM) devices in a single package for cellular phone applications.
The new six-chip MB84VY6A4A1 MCP uses Fujitsu's new Package Stacked Multi-chip Package (PS-MCP) technology to bond a pair of packages into a single unit that includes all six memory chips. The package is divided into two independent data buses, so data and programs can be processed simultaneously, significantly reducing processing time. The new product is based on Fujitsu's PS-MCP technology, which was introduced in March 2002.
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