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Article: Hole preparation & metalization of high aspect ratio, high reliability backpanels: a discussion of what technology challenges face the fabricator in creating high-layer count, large format back planes.
- Article from:
- CircuiTree
- Article date:
- January 1, 2003
- Author:
CopyrightCOPYRIGHT 2003 BNP Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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High-layer count large format back planes are the life blood of several PWB fabricators. A review of several of these companies' technology roadmaps tells a vivid story. Certainly, manufacturers engaged in this type of work have invested significant sums of capital in order to be successful.
In this article, the focus will be on the metalization processes, including proper methods to desmear the high performance resin systems. Additionally, making holes conductive and electrodeposition technology processes will be presented in detail. Certainly, there is no free lunch, so problem areas will be addressed as well.
Technology Trends
Several well ...