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Article: Chemical vapor deposition (CVD). (Equipment Basics).
- Article from:
- Semiconductor International
- Article date:
- February 1, 2003
- Author:
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Chemical vapor deposition (CVD) is the most widely used technique for depositing many materials in the semiconductor industry, including a wide range of dielectrics and many metals and metal alloys. In theory, it is quite simple: Two or more materials in a gaseous form are introduced into a reaction chamber where they chemically react with one another to form a new material that is deposited on the wafer surface. A good example is the deposition of silicon nitride ([Si.sub.3][N.sub.4]), formed by the reaction of silane and nitrogen.
In practice, however, the reactions can be quite complicated in that there are a wide variety of deposition parameters that must be ...