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Article: Performance of Ultrathin Dielectric Materials to Be 3M Topic at IPC Printed Circuits Expo.
- Article from:
- Business Wire
- Article date:
- March 18, 2003
CopyrightCOPYRIGHT 2003 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Business Editors/High-Tech Writers
IPC Printed Circuits Expo 2003
AUSTIN, Texas--(BUSINESS WIRE)--March 18, 2003
"Electrical Performance Advantages of Ultrathin Dielectric Materials Used for Power-Ground Cores in High-Speed, Multilayer Printed Circuit Boards" will be presented at IPC Printed Circuits Expo 2003 by Joel Peiffer, engineering specialist with the 3M Organic Materials Technology Center. Peiffer co-authored the paper with Bob Greenlee of Merix Corp. and Istvan Novak of Sun Microsystems. The electrical performance improvements, as well as the required changes in processing and material handling required to successfully manufacture ...