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Article: HDI-buildup technology and microvias: no longer a mystery: you've been hearing for years that HDI technology will revolutionize the pc-board industry. Now, it's finally happening. (design feature).(high-density-interconnect)
- Article from:
- EDN
- Article date:
- March 6, 2003
- Author:
CopyrightCOPYRIGHT 2003 Reed Business Information, Inc. (US). This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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CONSUMERS' ESCALATING demand for more features in their small and mobile electronics products, such as PDAs and cell phones, is driving a need for smaller feature sizes, process geometries, and pc boards. For engineers dealing with these desires, the need for HDI (high-density-interconnect) technology has become a reality. Happy Holden, manager of advanced technologies for Westwood Associates, describes HDI technology as a process that lets you produce a pc-board with through-hole, blind, or buried vias of less than 0.006 in. in diameter without using conventional drilling technology. Users of HDI technology must be able not only to assess and implement next-generation ...