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Article: Kodak to showcase new printed circuit board film packaging at IPC EXPO; New Kodak printed circuit board (PCB) film packaging helps significantly reduce artifacts.
- Article from:
- M2 Presswire
- Article date:
- March 19, 2003
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M2 PRESSWIRE-19 March 2003-Eastman Kodak: Kodak to showcase new printed circuit board film packaging at IPC EXPO; New Kodak printed circuit board (PCB) film packaging helps significantly reduce artifacts(C)1994-2003 M2 COMMUNICATIONS LTD
RDATE:03182003
ROCHESTER, NY -- Eastman Kodak Company's Aerial and Industrial Materials business will showcase its improved PCB film packaging at the IPC Expo March 24-27, 2003 in Long Beach, California along with its full line of photoplotter films, processing chemicals and equipment specifically designed for PCB applications.
The new film packaging includes improvements to its vacuum-sealed foil bag and ...