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Article: MCX connector meets dense packaging requirements. (Connectors).(Bomar Interconnect Products' MCX E-Snap LP)(Brief Article)
- Article from:
- EDN
- Article date:
- March 20, 2003
CopyrightCOPYRIGHT 2003 Reed Business Information, Inc. (US). This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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A low-profile MCX connector joins the E-Snap series of subminiature edge-mount RF connectors for wireless designs. Designated the MCX E-Snap LP, the device provides an above-board height of just 2.7 mm and needs only 1.06 mm below the board. Its snap-in design ensures strong board retention, locking firmly in place for reflow soldering without the use of adhesives. In addition to the MCX, the ...
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