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Article: iSuppli: Xbox 360 Teardown Highlights IBM's Dominance in Next- Generation Consoles

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Wireless News
Article date:
November 27, 2005
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Wireless News
11-27-2005
iSuppli: Xbox 360 Teardown Highlights IBM's Dominance in Next- Generation Consoles

WIRELESS NEWS-November 27, 2005-iSuppli: Xbox 360 Teardown Highlights IBM's Dominance in Next-Generation Consoles (C)2005 10Meters - http://www.10meters.com

A dissection of Microsoft's new Xbox 360 Premium video-game console conducted by iSuppli Corp.'s Teardown Analysis Service indicates that IBM silicon is a key factor driving the cost and functionality of the product.
Beyond the Xbox 360, IBM chips are also at the heart of two other next-generation game consoles set to hit the market in the coming months. Thus, while it's too early to say whether Microsoft's Xbox 360 will prevail ...

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