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Article: FormFactor Bolsters Wire Bond Logic Probe Card Family
- Article from:
- Wireless News
- Article date:
- December 9, 2007
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Wireless News
12-09-2007
FormFactor Bolsters Wire Bond Logic Probe Card Family
WIRELESS NEWS-December 9, 2007-FormFactor Bolsters Wire Bond Logic Probe Card Family (C)2007 10Meters - http://www.10meters.com
FormFactor announced the latest addition to its TrueScale probe card family for wire bond system-on-chip (SoC) devices.
Offering scalability down to 40 micron pad pitch, the TrueScale PP40 wafer probe card is designed to enable high-efficiency and high parallelism wafer probing on advanced wire bond logic and SoC devices, the company noted.
As the functionality and complexity of wire bond logic devices continue to rise, the number of I/Os per device is increasing. By supporting pad ...