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Article: Unisem and FlipChip International Ink Licensing Pact

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Wireless News
Article date:
June 21, 2008
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Wireless News
06-21-2008
Unisem and FlipChip International Ink Licensing Pact

WIRELESS NEWS-June 21, 2008-Unisem and FlipChip International Ink Licensing Pact (C)2008 10Meters - http://www.10meters.com

Unisem (M) Berhad (Unisem) and its subsidiary Unisem-Advanpack Technologies Sdn Bhd (UAT) announced that they have entered into an agreement with FlipChip International, LLC (FCI) for the licensing of FCI's wafer bumping and wafer level packaging technologies.
As part of the agreement, the groups noted, UAT will license FCI's core technologies, including its premier Spheron technology. FCI will further solidify its investment in the partnership by becoming a shareholder of UAT.

FCI's wafer ...

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