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Article: BeSang Demos Multi-Layer 3D IC Technology
- Article from:
- Wireless News
- Article date:
- August 11, 2009
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Wireless News
08-11-2009
BeSang Demos Multi-Layer 3D IC Technology
Type: News
BeSang, a semiconductor company based in Beaverton, OR, said it has developed a multi-layer stacked three-dimensional (3D) integrated circuit (IC) technology.
According to officials, this 3D IC technology enables low-cost solid-state drives (SSD), semiconductor memories, image sensors, and logic products with embedded memory blocks.
This 3D IC technology includes four single-crystalline silicon layers having 200 nm to 60 nm feature size vertical device structures which are processed at low temperatures, below 400 degree Celsius. The four single-crystalline silicon layers are formed above a silicon substrate with ...