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Article: California Inventors Develop Probe Card Assembly System
- Article from:
- US Fed News Service, Including US State News
- Article date:
- October 25, 2006
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ALEXANDRIA, Va., Oct. 25 -- Sammy Mok of Cupertino, Calif., and Fu Chiung Chong of Saratoga, Calif., have developed probe card assemblies with photolithography-patterned spring contacts for use in the testing or burn-in of integrated circuits.
According to the U.S. Patent & Trademark Office: "Several embodiments of integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both micro-electromechanical switches (MEMS) and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal ...