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Article: Japanese Inventors Develop Wave Soldering Method
- Article from:
- US Fed News Service, Including US State News
- Article date:
- October 28, 2006
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ALEXANDRIA, Va., Oct. 28 -- Tetsuya Nakatsuka, Masahide Okamoto and Tomoyuki Ohmura, all from Yokohama, Japan, and Asao Nakano of Kamakura, Japan, have developed a wave soldering method using lead-free solder, an apparatus therefor, and a wave-soldered assembly.
An abstract of the invention, released by the U.S. Patent & Trademark Office, said: "The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate from the upper side is wave soldered by contact with a molten lead-free solder ...