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Trends in the Stencil Printing Process
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SMT
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November 1, 2005
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Copyright informationCopyright PennWell Publishing Company Nov 2005. Provided by ProQuest LLC. (Hide copyright information)
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WHAT TRENDS WILL DRIVE SOLDER PASTE PRINTING PROCESS TECHNOLOGY OVER THE NEXT SEVERAL YEARS? THIS ARTICLE EXAMINES TWO MAJOR TRENDS TO INFLUENCE AND DRIVE THE STENCIL PRINTING PROCESS - LEAD-FREE AND COMPONENT MINIATURIZATION.
The first trend expected to drive the stencil printing process is the conversion to lead-free soldering materials. Although there are a number of electronic manufacturers that have successfully made the conversion to lead-free solder materials, most manufacturers are preparing for this transition. In 2006, many electronic manufacturers will be required to introduce a manufacturing process that will not use any materials containing lead. The RoHS regulation requires ...
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