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Article: Part 3: Testing and Assessing Lead-free Reliability
- Article from:
- SMT
- Article date:
- August 1, 2006
- Author:
CopyrightCopyright PennWell Publishing Company Aug 2006. Provided by ProQuest LLC. (Hide copyright information)
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This column touches on key parameters and tactics that can enhance solder joint reliability and PCB assembly integrity. Solder joints are critical connections mechanically, thermally, and electrically to a PCB assembly, but solder joints, per se, do not account for all aspects of PCB assembly integrity. By pursuing respective practicality and feasibility, we can elect relevant tactics and take necessary routes to achieve reliability enhancements. Three ways to maximum solder joint reliability are:
* Minimize the mismatch of the coefficient of thermal expansion (CTE) between the components and PCB substrate that a solder joint is destined to join.
* Make the component as pliable as possible.