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Article: Taiwanese Inventors Develop Lead Frame
- Article from:
- US Fed News Service, Including US State News
- Article date:
- February 28, 2007
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ALEXANDRIA, Va., Feb. 28 -- Lien-Chen Chiang and Wei-Sheng Lin, both of Taichung Hsien, Taiwan, have developed a lead frame for improving molding reliability and a semiconductor package with the lead frame.
According to the U.S. Patent & Trademark Office: "At least one embossed structure, such as a metal bump or recessed portion, is formed on a bonding layer of a wire-bonding area of the lead frame. At least one semiconductor chip is electrically connected to the lead frame via bonding wires bonded to the bonding layer."
An abstract of the invention, released by the Patent Office, said: "During a molding process for fabricating an encapsulant to encapsulate the chip, the bonding wires ...