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Article: Colorado Inventors Develop Low Thermal Resistance Power Module Assembly
- Article from:
- US Fed News Service, Including US State News
- Article date:
- March 17, 2007
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ALEXANDRIA, Va., March 17 -- Vahab Hassani of Denver, Andreas Vlahinos of Castle Rock, Colo., and Desikan Bharathan of Arvada, Colo., have developeda power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium.
According to the U.S. Patent & Trademark Office: "The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface. A circuit substrate is provided and positioned on the spreader plate to cover the coolant passageways. The circuit substrate includes a bonding layer configured to extend about the periphery of each of the coolant passageways and ...