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Article: Japanese Inventors Develop Optical Wiring Substrate Fabrication Method
- Article from:
- US Fed News Service, Including US State News
- Article date:
- April 4, 2007
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ALEXANDRIA, Va., April 4 -- Daisuke Nakaya, Takeshi Fujii, YojiOkazaki, Kazuhiko Nagano and Hiromi Ishikawa, all from Kanagawa, Japan, have developed an optical wiring substrate fabrication method and optical wiring substrate device therewith.
According to the U.S. Patent & Trademark Office, the invention relates to an "optical wiring substrate fabrication method capable of simple formation, by maskless exposure, of an inclined face shape at an end portion of a core layer structuring an optical waveguide. Using an exposure apparatus, image exposure is carried out with a light beam which is modulated by a spatial modulation element in accordance with image information."
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Article: Japanese Inventors Develop Wiring Substrate with ...
US Fed News Service, Including US State News;
September 9, 2008 ;
524 words
... ... Japan, and Michitoshi Nakata of Tajimi, Japan, have developed a wiring substrate with resin. According to the U.S. Patent & Trademark Office: "A wiring substrate, in which a wiring stacked portion including a conductor layer and ...
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