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Article: Taiwanese Inventor Develops Chip Package Designing Method
- Article from:
- US Fed News Service, Including US State News
- Article date:
- May 15, 2007
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ALEXANDRIA, Va., May 15 -- Shih-Cheng Chang of Hsinchu, Taiwan, has developed a method for completing a flip chip package design by re-using mask designs in a tool library.
According to the U.S. Patent & Trademark Office: "The method comprises analyzing one or more input/out bump locations of a chip, analyzing one or more solder ball locations of a package hosting the chip with regard to a predetermined printed circuit board, and designing the package hosting the chip by using a tool library containing one or more existing mask designs for re-use, wherein when one or more existing mask designs are used for the package, at least one custom connection layer of the package is redesigned ...