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Article: U.S., Singapore Inventors Develop Integrated Circuit Die
- Article from:
- US Fed News Service, Including US State News
- Article date:
- July 12, 2007
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ALEXANDRIA, Va., July 12 -- Il Kwon Shim and Seng Guan Chow, both of Singapore, and Virgil Cotoco Ararao of Atlanta, have developed an integrated circuit die.
According to the U.S. Patent & Trademark Office: "An integrated circuit die is provided having a body portion having a singulation side and a pedestal portion extending from the body portion and having a singulation side coplanar with the singulation side of the body portion."
The inventors were issued U.S. Patent No. 7,242,101 on July 10.
The patent has been assigned to St Assembly Test Services Ltd, Singapore.
The original application was filed on July 19, 2004, ...