Article: Japanese Inventors Develop Dicing/Die Bonding Adhesion Tape

ALEXANDRIA, Va., July 18 -- Shouhei Kozakai, Akio Suzuki, Nobuhiro Ichiroku and Toshio Shiobara, all from Usui-gun, Japan, have developed a dicing/die bonding adhesion tape.

According to the U.S. Patent & Trademark Office: "A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2 2.0 newton/25 millimeter is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising a polyimide resin, an epoxy resin, and an epoxy resin curing catalyst."

The inventors were issued U.S. Patent No. 7,244,495 on July 17.

The patent has been assigned to Shin-Etsu ...

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