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Article: Japanese Inventors Develop Dicing/Die Bonding Adhesion Tape
- Article from:
- US Fed News Service, Including US State News
- Article date:
- July 18, 2007
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ALEXANDRIA, Va., July 18 -- Shouhei Kozakai, Akio Suzuki, Nobuhiro Ichiroku and Toshio Shiobara, all from Usui-gun, Japan, have developed a dicing/die bonding adhesion tape.
According to the U.S. Patent & Trademark Office: "A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2 2.0 newton/25 millimeter is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising a polyimide resin, an epoxy resin, and an epoxy resin curing catalyst."
The inventors were issued U.S. Patent No. 7,244,495 on July 17.
The patent has been assigned to Shin-Etsu ...