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Article: U.S., Singapore Inventors Develop Semiconductor Stacked Die Packaging Apparatus
- Article from:
- US Fed News Service, Including US State News
- Article date:
- July 25, 2008
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ALEXANDRIA, Va., July 25 -- Virgil Cotoco Ararao of Atlanta, and Harvey Kong of Singapore, have developed a semiconductor package fabrication method.
According to the U.S. Patent & Trademark Office: "A method and apparatus for stacked die packaging provide a leadframe configured for supporting a lower semiconductor die. At least one pillar is formed on the leadframe for supporting an upper semiconductor die. The pillar is formed integrally with and of the same material as the leadframe, and is sized to have a predetermined height that is higher than the height of such a lower semiconductor die plus the height of bonding wires for such a lower semiconductor die plus a predetermined ...