|
|
Article: Delaware Inventor Develops Polyurethane Polishing Pad
- Article from:
- US Fed News Service, Including US State News
- Article date:
- August 25, 2008
CopyrightCopyright © HT Media Ltd. All Rights Reserved. Provided by ProQuest LLC. (Hide copyright information)
|
ALEXANDRIA, Va., Aug. 25 -- Mary Jo Kulp of Newark, Del. has developed a polishing pad for planarizing semiconductor.
According to the U.S. Patent & Trademark Office: "The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a cast polyurethane polymeric material formed with an isocyanate-terminated reaction product formed from a prepolymer reaction of a prepolymer polyol and a polyfunctional isocyanate. The isocyanate-terminated section product has 4.5 to 8.7 weight percent unreacted nuclear control operator; and the isocyanate-terminated reaction product is cured with a curative agent selected from the ...