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Article: Japanese Inventors Develop Semiconductor Device Electronic Component Unit
- Article from:
- US Fed News Service, Including US State News
- Article date:
- October 3, 2008
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ALEXANDRIA, Va., Oct. 3 -- Junichi Sonoda, Seiichiro Kobayashi and Kazuyuki Yoshimizu, all from Tokyo, have developed a manufacturing method for semiconductor device.
According to the abstract released by the U.S. Patent & Trademark Office: "A light emitting diode chip having first and second electrodes on opposite principal surfaces, is bonded to a substrate through a composite bonding layer. The composite bonding layer is formed when a support substrate including the substrate and a first bonding layer is bonded to a lamination structure including the LED, the first electrode and a second bonding layer. The first or second bonding layer contains at least part of eutectic composition. ...