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Article: Patent No. 7,479,202 Issued on Jan. 20, Assigned to Anwell Precision Technology, Dongguan Anwell Digital Machinery for Bubble-Free Techniques (Chinese Inventors)
- Article from:
- US Fed News Service, Including US State News
- Article date:
- March 27, 2009
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ALEXANDRIA, Va., March 27 -- Kai Leung Fan and Ming Sang Yeung, both of Hong Kong , has have developed a bubble-free techniques for bonding substrates. The inventors were issued U.S. Patent No. 7,479,202 on Jan. 20.
The patent has been assigned to Anwell Precision Technology (HK) Ltd., Hong Kong, and Dongguan Anwell Digital Machinery Co. Ltd., China.
According to the abstract released by the U.S. Patent & Trademark Office: "Techniques for producing optical medium that can be read at substantially high speeds with greater stability and accuracy are disclosed. According to one aspect of the techniques, a bonding station is employed with what is referred to as a bubble-free bonding ...
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