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Article: Patent No. 7,552,532 Issued on June 30, Assigned to EPCOS for Component Encapsulation Method (German Inventors)
- Article from:
- US Fed News Service, Including US State News
- Article date:
- July 6, 2009
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ALEXANDRIA, Va., July 6 -- Alois Stelzl, Hans Krueger and Gregor Feiertag, all from Munich, Germany, and Ernst Christl of Vilsbiburg, Germany, have developed a method for hermetically encapsulating a component. The inventors were issued U.S. Patent No. 7,552,532 on June 30.
The patent has been assigned to EPCOS AG, Munich.
According to the abstract released by the U.S. Patent & Trademark Office: "A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises attaching and electrically contacting a component based on a chip to a carrier comprising ...