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Article: Patent No. 7,561,431 Issued on July 14, Assigned to AOPEN for Double Housing Mutually Stacking Structure (Taiwanese Inventors)
- Article from:
- US Fed News Service, Including US State News
- Article date:
- July 15, 2009
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ALEXANDRIA, Va., July 15 -- Sheng-Hsiung Cheng, Te-An Lin, Wu-Nan Wang, and Chia-Chia Huang, all from Taipei Hsien, Taiwan, have developed a double housing mutually stacking structure with first and second housing. The inventors were issued U.S. Patent No. 7,561,431 on July 14.
The patent has been assigned to AOPEN Inc., Hsichih, Taiwan.
According to the abstract released by the U.S. Patent & Trademark Office: "A double housing mutually stacking structure comprises first and second housing. The first and second housing are respectively constituted at least by first and second motherboard blocking walls, first and second front walls, first and second rear walls, a first upper cover and a ...